Meeting the needs of customers engaged in device manufacturing, microelectronics packaging, printed circuit board assembly and other emerging integrated circuit packaging technologies. The Microelectronics Group is a dedicated team of application engineers that develop gas technology for the electronics packaging industry. Backed by a research staff located in our Electronics R&D Center in Allentown, PA, our engineers combine the latest technological development with hands-on process knowledge to help improve your operation.

 
Developing gas and chemical technologies.
Providing process technical support.
Evaluating and developing new applications.
Providing technology focus and assessment.
Offering global applications support.
Supporting diverse technologies: printed circuit board soldering, hybrid
circuits, advanced packaging and assembly, PCB manufacturing and
fibreoptics and flat panel displays.
 
For further information please click through to our
Global Website or contact us directly.
 
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